Development and supply of complete turn key products

Technical capabilities include:

• Active alignment of optic to interface
• Plug and Play modules
• Passive Mount
• Secure connections
• Low insertion loss (< 0.3 dBA)
• High pointing accuracy 0,1 mrad
• MTF > 80%
• Telcordia compliant
• Support LED / Laser diode / White light
• Manufacturing friendly
• Assemblies on semicon wafers and structures
• Reflow solder able lens stacks and camera modules
• Measurement & Detection
• Micro manipulation
• Codesign and project management